Weighted transaction card

ABSTRACT

Weighted transaction cards and methods of manufacturing the same. The weighted transaction cards may include a metallic member that comprises at least a portion of a layer of the transaction card. The metallic member may be encapsulated and/or disposed in an opening of a surround to define an inlay. The inlay may be laminated with one or more additional layers according to traditional card manufacturing techniques (e.g., a hot lamination process). The weighted transaction cards may have a weight significantly greater than traditional plastic transaction cards such that the weighted transaction cards. The inlay may include an antenna for contactless or dual interface with transaction card readers.

RELATED APPLICATIONS

This application is a continuation in part of U.S. patent applicationSer. No. 15/234,733, filed Aug. 11, 2016, entitled “WEIGHTED TRANSACTIONCARD,” which is a continuation of U.S. patent application Ser. No.14/834,200, filed Aug. 24, 2015, issued as U.S. Pat. No. 9,430,724 onAug. 30, 2016, entitled “WEIGHTED TRANSACTION CARD,” which is acontinuation of U.S. patent application Ser. No. 14/501,386, filed Sep.30, 2014, issued as U.S. Pat. No. 9,117,155 on Aug. 25, 2015, entitled“WEIGHTED TRANSACTION CARD,” which is a continuation of U.S. applicationSer. No. 13/840,621 filed Mar. 15, 2013, issued as U.S. Pat. No.8,857,722 on Oct. 14, 2014, entitled “WEIGHTED TRANSACTION CARD,” whichclaims benefit of priority to U.S. Provisional Application No.61/674,143, filed Jul. 20, 2012, entitled “WEIGHTED TRANSACTION CARD,”all of which applications are incorporated herein by reference in theirentirety.

FIELD OF THE INVENTION

The prevalence of the use of transaction cards continues to grow. Withthe increasing use of transaction cards by individuals for value inpurchases, the market for different types of transaction cards alsocontinues to grow.

In this regard, a number of different varieties of cards are offered toconsumers that may each offer a unique set of benefits and features. Forexample, a number of ultra-premium transaction card types have beenproposed that are marketed to individuals with high net worth that alsoestablish large balances using a transaction card. Card issuers thatoffer such ultra-premium transaction card types often provide associatedpremium services to holders of such ultra-premium transaction cards suchas, for example, concierge services, increased involvement rewardsprograms, increased travel benefits, consumer protection features withrespect items purchased using such cards, or other ultra-premiumservices not typically offered with standard transaction cards.

In addition to ultra-premium services offered in connection with suchtransaction cards, card issuers may also wish to provide a premiumphysical card as evidence of the ultra-premium nature of the transactioncard. In fact, the awareness of such ultra-premium transaction cards hasgrown to the point where such ultra-premium cards have become associatedwith the high net worth individuals to whom such cards are issued. Inthis regard, such ultra-premium cards have become status symbols formany individuals.

To further increase the exclusivity of such cards and to differentiatesuch cards from traditional transaction cards, it has been proposed tomanufacture cards using different precious metals rather than thetypical plastic materials employed in traditional cards. For example,titanium, palladium, other precious metals, or the like have beenproposed to be used to construct ultra-premium transaction cards.However, to produce precious metal cards of the kind proposed for use inthe ultra-premium transaction card market, it is often the case thattraditional methods of card manufacture are not applicable. In turn, thecost of such cards is often much greater than the cost associated withthe production of traditional transaction cards made from plastics andthe like. For example, art work and other indicia (e.g., accountnumbers, a name associated with the account, expiration dates,verification codes, terms and conditions, and/or other necessaryindicia) associated with a transaction card may be provided on atransaction card. In the case of metallic cards, such art work and/orother indicia may be directly created in the precious metal of the cardby such processes as laser etching, machining, etching, or otherrelatively costly processes. It has further been proposed that layersincluding the transaction card indicia be adhered to the metalsubstrate. However, each of these approaches requires costlymanufacturing techniques not normally associated with the production oftransaction cards such that the cost for each card may be much more thantraditional transaction cards. Furthermore, the cost of the rawmaterials for precious metal cards may be much greater than thematerials used to construct traditional plastic cards. In this regard,many card issuers that offer ultra-premium transaction cards of thisnature do not directly recoup the increased production costs of suchcards when offering such cards to individuals (e.g., by way of fixedinitiation fees or annual fees) with the understanding that the high networth individuals to whom the card is offered will more than likely usethe transaction card to a degree so as to provide substantial revenue tothe card issuer despite the loss associated with the production of thecard. However, the reach of such ultra-premium cards has beencorrespondingly limited to a relatively small portion of the transactioncard market as a result of the difficulty in large scale manufacture ofultra-premium cards.

Additionally, due to the physical features of metal substrates employedin many ultra-premium cards, the implementation of “contactless” anddual-interface compabilities has presented numerous challenges. Forexample, in many potential implementations, such metal substratesseverely limit the ability to realize acceptable transception of RFsignals between a transaction card and a contactless card reader device.In turn, as the prevalence of contactless and dual-interface transactioncards has increased, the provision of ultra-premium, metal transactioncards having such capabilities has not kept pace.

SUMMARY

The present disclosure generally relates to weighted transaction cardsthat may provide characteristics (e.g., corresponding to the look and/orfeel of the card) that provide an ultra-premium quality to transactioncards that may be satisfying to a card user. However, in contrast toprevious ultra-premium transaction card production techniques, theweighted transaction cards described herein may employ traditional cardmanufacturing techniques in their construction so as to significantlyreduce the costs associated with production of such cards while alsoaccommodating implementation of contactless and dual-interfacefunctionality.

In this regard, a card with detectable physical properties (e.g., theweight of the card) that are evident when the card is handled may beproduced for costs much less than traditional ultra-premium cards madefrom precious metals and may be produced for costs approaching the costof traditional plastic cards. In this regard, such weighted transactioncards may provide a similar impression of quality or an ultra-premiumnature without the high production costs normally associated withultra-premium transaction cards. As such, the segment of the market towhich such weighted cards may be economically offered may be muchgreater than the segment of the market to which traditionalultra-premium cards are offered.

In this regard, a first aspect presented herein includes a transactioncard in which at least a portion of a first layer of the transactioncard comprises a metal portion. The transaction card may also include asecond layer that may be attached to the first layer.

In an embodiment, the second layer may be adhered to at least part of alateral extent of a side of the metal portion. In an application, themetal portion may be substantially homogenous. In this regard, the metalportion may comprise a solid metal member. In an implementation, themetal portion may be single piece member. In an embodiment, the metalportion may comprise a tungsten member. In this regard, at least aportion of the tungsten member may comprise tungsten. For example, in anembodiment, at least a majority of the tungsten member may comprisetungsten. In some preferred applications, the tungsten member maycomprise at least 75%, at least 80%, at least 85%, or even at least 90%tungsten.

In an embodiment a weight of the tungsten member may comprise at leastabout 40% of the total weight of the transaction card, and in anotherimplementation, the weight of the tungsten member may comprise at leastabout 50% of the total weight of the transaction card. In an embodiment,the total weight of the tungsten member may comprise less than about 90%of the total weight of the transaction card, and in another application,the total weight of the tungsten may comprise less than about 80% of thetotal weight of the transaction card. In an implementation, the weightof the tungsten member may be at least about 8 g, and in an embodiment,the weight of the tungsten member may be at least about 10 g. In anembodiment, the weight of the tungsten member may be less than about22.6 g, and in a certain implementation the weight of the tungstenmember may be less than about 14 g. In an embodiment, the total weightof the transaction card may be at least about 10 g, and in animplementation the total weight of the transaction card may be at leastabout 15 g. In an embodiment, the total weight of the transaction cardmay be less than about 25 g, and in an application, the total weigh ofthe transaction card may be less than about 20 g.

In an embodiment, for a given deflection test, the weighted transactioncard may undergo a reduction in deflection of at least about 30% fromthe deflection of a traditional plastic transaction card, and in anapplication, the weighted transaction card may undergo a reduction indeflection of at least about 40% from the deflection of a traditionalplastic transaction card. In an application, for a given test, theweighted transaction card may undergo a reduction in deflection of lessthan about 90% from the deflection of a traditional plastic transactioncard, and in an application, the weighted transaction card undergo areduction in deflection of less about 80% from the deflection of atraditional plastic transaction card.

In a characterization, the weighted card may be deflectable, e.g.,substantially elastically deformable, between a planar configuration andan arcuate configuration along at least a portion of a length of thecard (e.g., corresponding with the longitudinal axis thereof), whereinthe arcuate configuration has a radius of curvature of about 68 mm (2.7in) or less. In an implementation, the weighted card may be deflectable,e.g., substantially elastically deformable, between a planarconfiguration and an arcuate configuration along at least a portion of awidth of the card (e.g., corresponding with a cross-axis that istransverse, e.g., normal, to the longitudinal axis of the card), whereinthe arcuate configuration has a radius of curvature of about 68 mm (2.7in) or less.

In an embodiment, the weighted card may be deflectable, e.g.,substantially elastically deformable, through an angle of at least about3° per 5.1 mm (0.2 in), and preferably at least about 4.5° per 5.1 mm(0.2 in), along a length of the card (e.g., corresponding with thelongitudinal axis thereof). In the same or other embodiments, theweighted card may be deflectable, (e.g., substantially elasticallydeformable) through an angle of at least about 5° per 5.1 mm (0.2 in),and preferably at least about 7.5° per 5.1 mm (0.2 in), along a width ofthe card (e.g., corresponding with a cross-axis that is transversely,e.g., normal to the longitudinal axis of the card). In animplementation, the weighted card may be deflectable, e.g.,substantially elastically deformable, through an angle of less thanabout 20° per 5.1 mm (0.2 in), along a length of the card (e.g.,corresponding with the longitudinal axis thereof), and preferably lessthan about 18.5° per 5.1 mm (0.2 in), along a length of the card (e.g.,corresponding with the longitudinal axis thereof). In the same or otherembodiments, the weighted card may be deflectable, (e.g., substantiallyelastically deformable) through an angle of less than about 15° per 5.1mm (0.2 in), and preferably less than about 12° per 5.1 mm (0.2 in),along a width of the card (e.g., corresponding with a cross-axis that istransversely, e.g., normal to the longitudinal axis of the card).

In an embodiment, the thickness tungsten member may be at least about0.127 mm (0.005 in), and in an application, the thickness of thetungsten may be at least about 0.191 mm (0.0075 in). In an embodiment,the tungsten member may be less than about 0.4064 mm (0.016 in), and inan implementation, the tungsten member may be less than about 0.254 mm(0.010 in). In an embodiment, the tungsten member comprises a length atleast about 50% of the length of the transaction card, and in anapplication, the length of the tungsten member may be at least about 70%of the length of the transaction card. In an embodiment, the tungstenmember may comprise a length less than about 90% of the length of thetransaction card, and in an implementation, the tungsten member maycomprise a length less than about 85% of the length of the transactioncard.

In an embodiment, the tungsten member may comprise a width at leastabout 50% of the width of the transaction card, and in animplementation, the tungsten member may comprise a width at least about60% of the width of the transaction card. In an embodiment, the tungstenmember may comprise a width less than about 90% of the width of thetransaction card, and in an implementation, the tungsten member maycomprise a width less than about 80% of the width of the transactioncard.

In an embodiment, the tungsten member may comprise a length of at leastabout 42.8 mm (1.69 in). In an application, the tungsten member maycomprise a length of less than about 77.0 mm (3.03 in). In anembodiment, the tungsten member may comprise a width of at least about27.0 mm (1.06 in). In an application, the tungsten member may comprise awidth of less than about 48.6 mm (1.91 in).

In an embodiment, the first layer may include a surround into which themetal portion (e.g., the tungsten member) is inlaid. In this regard, thesurround may define an opening into which the tungsten member isreceived. Accordingly, the surround may include at least a first edgedefining the opening that is adjacent to an edge of the tungsten member.In an embodiment, the opening may include a corresponding number ofedges as the tungsten member such that the opening is shaped incorresponding relation to the tungsten member. In this regard, thetungsten member may about the surround along each edge of the tungstenmember.

In an embodiment, the opening may extend through the surround so as todefine an aperture extending therethrough. In this regard, the thicknessof the tungsten member may be substantially the same as the thickness ofthe surround. Accordingly, opposing major planes of the tungsten membermay be coplanar with corresponding opposing major planes of the surroundonce the tungsten member is inlaid with respect to the surround. Assuch, the tungsten member and surround may define an inlay layer havinga first side and a second side. The first side and the second side mayhave substantially continuous planar surfaces along the opposing majorplanes of the tungsten member and the surround.

In an embodiment, an encapsulant may be disposed about the metal portion(e.g., tungsten member). For example, the encapsulant may secure thetungsten member in inlaid relation relative to the surround. In thisregard, the encapsulant may extend between edges of the tungsten memberand edges of the opening of the surround. In an embodiment, theencapsulant may also extend along the major planes of the tungstenmember (e.g., in a case where the tungsten member is thinner than thesurround). In any regard, once applied, the encapsulant may create asubstantially continuous planar surface along the first and second sidesof the inlay layer. The inlay layer may also include a film layerapplied along the first and second sides thereof. The film layers may beapplied directly to the surround and the tungsten member or may beapplied to the surround and the encapsulant covering the tungstenmaterial. In an embodiment, one or more graphics layers may also beattached to the inlay layer. For example, the one or more graphicslayers may comprise indicium indicative of an account associated withthe transaction card.

In an embodiment, the encapsulant may have a hardness at least about 30%of the hardness of the tungsten member, and in an implementation, theencapsulant may have a hardness at least about 50% of the hardness ofthe tungsten member. In an application, the encapsulant may have ahardness less than about 95% of the hardness of the tungsten member, andin an implementation, the encapsulant may have a hardness less thanabout 85% of the hardness of the tungsten member. In an embodiment, theencapsulant may have a modulus of elasticity at least about 30% of themodulus of elasticity of the tungsten member, and in an implementation,the encapsulant may have a modulus of elasticity at least about 50% ofthe modulus of elasticity of the tungsten material. In an embodiment,the encapsulant may have a modulus of elasticity of less than about 95%of the modulus of elasticity of the tungsten member, and in anapplication, the encapsulant may have a modulus of elasticity less thanabout 85% of the modulus of elasticity of the tungsten material.

The encapsulant may include at least one of an epoxy, a resin, athermoset polymer, a thermoplastic polymer or the like. For example, invarious embodiments, the encapsulant may comprise at least one ofpolypropylene, nylon, polyester, ethylene-polyurethane, polyvinylbutyrate, vinyl chloride, silicone, polyvinyl alcohol, polyvinyl methylether, nitrocellulose, polyamide, bismaleimide, polyimide, epoxypolyester hybrid, and/or the like. In an embodiment, the surround maycomprise at least one of polyvinyl chloride (PVC), oriented polyester,polyethylene terephthalate, biaxially-oriented polyethyleneterephthalate, or polycarbonate. In an embodiment, the tungsten membermay comprise sintered tungsten.

In another embodiment, a transaction card may include a smart card chipdisposed in a pocket, indicia indicative of an account associated withthe transaction card, and an inlay. The inlay includes a metallicmember, a surround having an opening for receiving the metallic membertherein, and an antenna member provided on the surround. The metallicmember may include a relief portion to provide a space for the pocketand may comprise not less than about 40% of the total weight of thetransaction card. The transaction may further include a first graphicslayer attached to a first side of the inlay, and optionally, a secondgraphics layer attached to a second side of the inlay, wherein theaccount indicia may be provided at the first graphics layer and/or thesecond graphics layer.

In some implementations, the surround opening may extend entirelythrough the surround. In turn, the metallic member may be provided tohave a thickness that is equal to or substantially equal to (e.g. atleast about 90%) a thickness of the surround. Further, the inlay mayinclude a film layer on at least one side of, or film layers applied toopposing sides of, the surround to cover the opening. For example, filmlayers may be provided on each side of the inlay in interconnectedcontact with the surround and metallic member on opposing sides thereof,thereby maintaining interconnected positioning of the surround andmetallic member.

In one approach, the metallic member may be provided to have a reliefportion defined by an opening through the metallic member. In turn, aplug may be provided in such opening and milled to provide the pocketfor the smart card chip. In another approach, the relief portion of themetallic member may comprise a recess that is provided at an outer edgeof the metallic member. In turn, the surround may include a projectionthat extends in to the edge recess of the metallic member and milled toprovide the pocket for the smart card chip.

In contemplated embodiments, the antenna member may be provided toextend about the opening of the surround at least one time. In someimplementations the antenna member may include a first portion thatextends about the opening of the surround a plurality of times, and asecond portion that extends a plurality of times about the pocket withinthe space provided by the relief portion of the metallic member. In suchimplementations, the antenna member may include an intermediate portionthat extends between the first and second portions of the antenna.

In one approach, the second portion of the antenna member may beprovided on a plug that is disposed in an opening of the metallicmember. In another approach, the second portion of the antenna membermay be provided on an end portion of a projection of the surround thatextends in to an edge recess of the metallic member.

In some embodiments, the antenna member may be defined by a continuouslength of a metal wire. In such embodiments, the metal wire maypartially inset relative to the surface of the surround. For example,the metal wire may be partially embedded so that about 30% to 60% of thewire diameter is inset relative to the surface of the surround.

In contemplated arrangements, the smart card chip may be supportablyinterconnected to a downward-facing side of a substrate and electricallyinterconnected to another antenna member that is supportablyinterconnected to the downward-facing side of the substrate and spacedat least partially overlapping relation to a second portion of theantenna member for inductive coupling therewith. Optionally, pluralityof contact pads may be provided at an outward-facing side of thesubstrate and electrically interconnected to the smart card chip throughthe substrate.

Numerous additional features and advantages of the present inventionwill become apparent to those skilled in the art upon consideration ofthe embodiment descriptions provided hereinbelow.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 depicts an embodiment of a tungsten member as disposed in anopening of a surround.

FIG. 2 depicts an embodiment wherein the tungsten member may be securedwith respect to the surround by way of an encapsulant.

FIG. 3 depicts an embodiment of an inlay.

FIG. 4 depicts a cross section of an embodiment of an inlay taken at theboundary of a tungsten member and a surround.

FIG. 5 depicts an embodiment of a plurality of layers of an embodimentof a transaction card.

FIG. 6 depicts an embodiment of a transaction card undergoing a hotlamination process.

FIGS. 7-8 depict various examples of bulk processing of transactioncards.

FIG. 9 depicts an embodiment of a tungsten member disposed in a surroundhaving a relief portion provided therein.

FIG. 10 depicts an embodiment of a tungsten member disposed in asurround, where the tungsten member has a relief portion and thesurround has a corresponding projection.

FIG. 11 depicts the embodiment of FIG. 10, with a milled pocket providedin the surround for receipt of a device.

FIG. 12. depicts another embodiment of a tungsten member with a reliefportion in which a pocket for receiving a device is milled.

FIG. 13 depicts an embodiment of a tungsten member disposed in asurround having an antenna for wireless communication in a resultingtransaction card disposed therewith.

FIGS. 14A and 14B depict cross sectional embodiments of the embodimentof FIG. 13 taken along section line 14-14 in FIG. 13.

FIG. 15 depicts an embodiment of a transaction card show with an edge ofa surround showing at an edge of the transaction card.

FIG. 16 depicts the placement of a tungsten member relative to a machinereadable indicia in an embodiment of a transaction card.

FIG. 17 depicts an embodiment of a transaction card having a transparentmember extending relative to a portion of a tungsten member having asurface finish.

FIG. 18 depicts another embodiment of an inlay having a metallic memberdisposed in an opening of a surround and a plug disposed in an openingof the metallic member.

FIG. 19 depicts the inlay embodiment of FIG. 18 with an antenna providedon the surround and the plug.

FIG. 20 depicts the inlay embodiment of FIGS. 18 and 19 with opposingfilm layers provided on opposing sides thereof.

FIG. 21 depicts another embodiment of an inlay having a metallic memberdisposed in an opening of a surround and a projection of the surrounddisposed in an edge recess of the metallic member.

FIG. 22 depicts the inlay embodiment of FIG. 21 with an antenna providedon the surround and the projection thereof.

FIG. 23 depicts the inlay embodiment of FIGS. 21 and 22 with opposingfilm layers provided on opposing sides thereof.

FIG. 24 depicts another embodiment of an inlay having a metallic memberdisposed in an opening of a surround with an antenna provided on thesurround and a projection portion thereof.

FIG. 25 depicts a first side of an embodiment of a transaction card.

FIG. 26 depicts a second side of the transaction card embodiment of FIG.25.

FIG. 27 is cross-sectional view of the transaction card embodiment ofFIGS. 25 and 26 taken along section line AA shown in FIG. 25.

FIG. 28 depicts an exploded view of additional layers that may beprovided in the transaction card embodiment of FIGS. 25-27.

FIG. 29 depicts an embodiment of a multi-layer assembly from which aplurality of card bodies may be separated.

FIG. 30 illustrates a plurality of sheets that may be interconnected toprovide the multi-layer assembly of FIG. 29.

FIGS. 31A and 31B depict an embodiment of a metallic sheet from which aplurality of metallic members may be separated.

FIGS. 31C and 31D depict the plurality of separated metallic members ofFIGS. 31A and 31B disposed within corresponding openings of a surroundlayer sheet, with a corresponding plurality of antennas providedthereupon.

FIG. 31E depicts the surround layer sheet of FIGS. 31C and 31D with theopposing film sheets disposed on opposing sides thereof to provide aninlay sheet of the multi-layer assembly of FIGS. 29 and 30.

FIG. 32 depicts the multi-layer assembly of FIGS. 29 and 30 undergoing ahot lamination process.

FIG. 33 depicts a plurality of card bodies separated from themulti-layer assembly of FIGS. 29, 30 and 32.

DETAILED DESCRIPTION

The following description is not intended to limit the invention to theforms disclosed herein. Consequently, variations and modificationscommensurate with the following teachings, skill and knowledge of therelevant art, are within the scope of the present invention. Theembodiments described herein are further intended to explain modes knownof practicing the invention and to enable others skilled in the art toutilize the invention in such, or other embodiments and with variousmodifications required by the particular applications(s) or use(s) ofthe present invention.

The present disclosure generally relates to weighted cards and methodfor manufacturing the same, and in particular to weighted transactioncards that may be used for value in purchases and methods formanufacturing such weighted transaction cards. Specifically, the presentdisclosure includes cards that include a weighted mass that may compriseat least a portion of a layer of a card. In an embodiment, the weightedmass may be a metallic member. For example, the metallic member maycomprise stainless steel, palladium, platinum, gold, silver, ortungsten. In an embodiment, the weighted mass may be a tungsten member.Tungsten may be preferred as the weighted mass because tungsten includesadvantageous properties including high density, relatively goodworkability, and non-toxicity. Accordingly, while reference may be madeherein to a tungsten member, it may be appreciated that the descriptionmay generally apply to any weighted member (e.g., a weighted membercomprising any potential metal described above).

In this regard, a tungsten member that may be incorporated into atransaction card of traditional dimensions may impart significant weightto the finished transaction card. In an embodiment, the tungsten membermay be encapsulated such that it is in turn processable by traditionalmethods used in the production of transaction cards. For example, theencapsulated tungsten member may be processed using traditional hotlamination techniques to laminate the tungsten member with additionalcard layers. Accordingly, a relatively heavy card (e.g., at least twice,but more preferably 3 to 4 times the weight of a normal transactioncard) may be produced relatively inexpensively, using traditional cardprocessing techniques. In contrast, proposed approaches to use ofmetallic members in cards may not utilize traditional high volume cardproduction techniques such as hot lamination and may in turn rely oncostly techniques such as cold rolling, milling, and or other customapproaches to card production.

As depicted in FIG. 1, a weighted mass comprising a tungsten member 10may be inlaid into a surround 22 as depicted in FIG. 1. For example, thetungsten material 10 may comprise primarily tungsten with somepreferably small amount of one or more of nickel, iron, copper, or othermaterial. Such additional materials may be present in the tungstenmember 10 to increase the workability of the tungsten member 10. Assuch, the tungsten member 10 may be provided in a relatively thin platethat may correspond in size to a finished transaction card as will bediscussed in greater detail below. The tungsten member 10 may be produceby way of a sintering process to form the tungsten member 10. Thesurround 22 may comprise, for example, a polymer material. Examples ofpolymeric materials that may comprise the surround may include polyvinylchloride (PVC), polyethylene glycol (PEG), oriented polyester,biaxially-oriented polyethylene terephthalate (e.g., Melinex® availablefrom DuPont Teijin Films), polycarbonate, or other appropriate materialknown the card processing art.

The surround 22 may include an opening 20 that may be sized incorresponding relation to the tungsten member 10 so as to accommodatethe tungsten member 10 in the opening 20. In this regard, the tungstenmember 10 may be received, or inlaid, in the opening 20 of the surround20. Relatedly, the thickness of the tungsten member 10 may be equal toor less than the thickness of the surround 22 about the opening 20. Theopening 20 may be sized to be slightly larger dimensionally in lengthand width than the tungsten member 10 such that the tungsten member 10may be received by the opening 20 as depicted in FIG. 2.

An encapsulant 30 may be applied to the tungsten member 10 and/orsurround 22 so as to fill any space between the tungsten member 10 andthe surround 22 as depicted in FIG. 2. The encapsulant 30 may comprise amaterial that is applied and subsequently allowed to harden tosubstantially encapsulate the tungsten member 10 to secure the tungstenmember 10 within the opening 20 of the surround 22. While depicted inFIG. 2 as being disposed between the tungsten material 10 and thesurround 22, it will be appreciated that the encapsulant 30 may, in someembodiments, also substantially surround, or enclose, the tungstenmaterial 10 and/or the surround 22 (i.e., cover all sides thereof). Inthis regard, the tungsten member 10 may include a surface finish topromote adhesion of the encapsulant 30 and/or a film layer 40 (describedin greater detail below). Further still, the surface finish may bedecorative and at least partially visible in the finished transactioncard as described in greater detail below.

In various embodiments, different materials 30 may be used as theencapsulant 30 to secure the tungsten member 10 in an inlaid fashionwith respect to the surround 22. For example, the encapsulant 30 maycomprise one or more of epoxy, resin, a thermoset polymer, athermoplastic polymer, or the like. For example, specific examples mayinclude polypropylene, nylon, polyester, ethylene-polyurethane,polyvinyl butyrate, vinyl chloride, silicone, polyvinyl alcohol,polyvinyl methyl ether, nitrocellulose, polyamide, bismaleimide,polyimide, epoxy polyester hybrid, and/or the like.

Furthermore, the encapsulant 30 may be chosen to have properties topromote adhesion with respect to the tungsten member 10. In this regard,an encapsulant 30 having properties chosen so as to prevent the tungstenmember 10 from separating from the surround 22. For example, it may beappreciated that when the tungsten member 10 and the surround 22 areflexed, the tungsten member 10 and the surround 22 may undergo differentamounts of deflection for a given force applied. By matching theencapsulant to the tungsten material 10, the amount of differentialflexing the tungsten member 10 and the surround 22 undergoes may beminimized to as to reduce the tendency of the tungsten member 10 toseparate from the surround 22 once encapsulated with respect thereto. Inthis regard, it may be appreciated that any separation of the tungstenmember 10 from the surround 22 may result in processing defects later inthe card manufacture process corresponding to for example, ghosting ofgraphics, separation of card layers, or other defects.

Therefore, it may be desirable to maintain the tungsten member 10 inlaidwithin the envelope of the surround 22 defined by opening 20. In thisregard, the encapsulant 30 may assist in maintaining the tungsten member10 inlaid with respect to the surround 22. Accordingly, encapsulant 30may be chosen to have a hardness and/or flexing properties (e.g., amodulus of elasticity) close to or within a predetermined range of thehardness and/or modulus of elasticity of the tungsten member 10.

For example, the hardness of the tungsten member 10 may be or mayapproach 2570 MPa on the Brinell hardness scale and the modulus ofelasticity may be or may approach approximately 411 GPa. Accordingly, inan embodiment, the encapsulant 30 may have a hardness that is at leastabout 30% of the hardness of the tungsten member 10, and in animplementation the encapsulant 30 may have a hardness at least about 50%of the hardness of the tungsten member 10. In an application, theencapsulant 30 may have a hardness less than about 95% of the hardnessof the tungsten member 10, and in an embodiment, the encapsulant 30 mayhave a hardness less than about 85% of the hardness of the tungstenmember 10. In an embodiment, the encapsulant 30 may have a modulus ofelasticity that is at least about 30% of the modulus of elasticity ofthe tungsten member 10, and in an implementation the encapsulant 30 mayhave a modulus of elasticity at least about 50% of the modulus ofelasticity of the tungsten member 10. In an application, the encapsulant30 may have a modulus of elasticity less than about 95% of the modulusof elasticity of the tungsten member 10, and in an embodiment, theencapsulant 30 may have a modulus of elasticity less than about 85% ofthe modulus of elasticity of the tungsten member 10.

In an embodiment, the tungsten member 10 may be sized in correspondingrelation to the size of a finished card. For example, the InternationalOrganization for Standardization (ISO) may promulgate standardsgoverning the size and/or properties for finished transaction cards. Forexample, ISO 7810 and/or ISO 7816, both of which are incorporated hereinby reference, may specify transaction cards be 85.60 mm (3.375 in) inlength by 53.98 mm in width (2.125 in) by 0.76 mm (0.030 in) inthickness. As used herein, the term “length” may correspond to thegreatest dimension of the object, the term “width” may correspond to thenext smallest dimension of the object than the length, and the term“thickness” may refer to the smallest dimension of the object.Therefore, as stated above, in an embodiment, the tungsten member 10 mayhave length, width, and height dimensions that are in correspondingrelation relative to the finished transaction card in which the tungstenmember 10 is incorporated. In an embodiment, the tungsten member 10 mayhave a length that is at least about 50% of the length of thetransaction card, and in an implementation the tungsten member 10 mayhave a length that is at least about 70% of the length of thetransaction card. In an application, the tungsten member 10 may have alength that is less than about 90% of the length of the transactioncard, and in an embodiment, the tungsten member 10 may have a lengththat is less than about 85% of the length of the transaction card. In anembodiment, the tungsten member 10 may have a width that is at leastabout 50% of the width of the transaction card, and in animplementation, the tungsten member may have a width that is at leastabout 60% of the width of the transaction card. In an embodiment, thetungsten member 10 may have a width that is less than about 90% of thewidth of the transaction card, and in an implementation, the tungstenmember 10 may have a width that less than about 80% of the width of thetransaction card. In an embodiment, the tungsten member 10 may have athickness that is at least about 10% of the thickness of the transactioncard, and in an implementation, the tungsten member 10 may have athickness that is at least about 20% of the thickness of the transactioncard. In an application, the tungsten member 10 may have a thicknessless than about 40% of the thickness of the transaction card, and in anembodiment, the tungsten member 10 may have a thickness that is lessthan about 35% of the thickness of the transaction card. In a preferredembodiment, the tungsten member 10 may have a thickness that is at leastabout 30% of the thickness of the transaction card.

In an application, the tungsten member 10 may have a width of not lessthan about 30% and not more than about 60% of the width of thetransaction card. In this regard, as shown in FIG. 16, the tungstenmember 10 may be provided in nonoverlapping relative relation withrespect to a machine readable field 242 of the card. In FIG. 16, theposition of the tungsten member 10 in the finished transaction card isshown in ghosted lines. In this regard, it may be appreciated that thetungsten member 10 may be provided in the nonoverlapping relativerelation with respect to the machine readable field 242 to, for example,prevent interference with the reading of the machine readable field 242(e.g., such as by a magnetic reader in the case of a magnetic stripe).As may be appreciated, a reduction in the width of the tungsten member10 may be provided with a corresponding increase in the thickness and/orlength of the tungsten member 10 to maintain a weight of the card.

In an embodiment, the length of the tungsten member 10 may be at leastabout 42.8 mm (1.69 in). In an application, the length of the tungstenmember 10 may be less than about 77.0 mm (3.03 in). In an embodiment,the width of the tungsten member 10 may be at least about 27.0 mm (1.06in). In an application, the width of the tungsten member 10 may be lessthan about 48.6 mm (1.91 in). In an embodiment, the thickness of thetungsten member 10 may be at least about 0.127 mm (0.005 in). In anapplication, the thickness of the tungsten member 10 may be less thanabout 0.254 mm (0.030 in). In a preferred embodiment, the tungstenmember 10 may have dimensions of about 73.025 mm (2.875 in) in length by41.275 mm (1.625 in) in width by 0.254 mm (0.010 in) in thickness.

In an embodiment, the tungsten member 10 may have a density of at leastabout 15.0 g/cm³. In an implementation, the tungsten member 10 may havea density less than about 19.3 g/cm³. In a preferred embodiment, thetungsten member 10 may have density of about 17.5 g/cm³. In anembodiment, the tungsten member 10 may weigh at least about 8 g, and inan application, the tungsten member 10 may weigh at least about 10 g. Inan application, the tungsten member may weigh less than about 22.6 g,and in an implementation, the weight of the tungsten member 10 may beless than about 14 g. In an embodiment, the weight of the tungstenmember 10 may represent at least about 40% of the overall weight of thetransaction card, and in an implementation, the tungsten member 10 mayrepresent at least about 50% of the overall weight of the transactioncard. In an embodiment, the tungsten member 10 may weigh less than about90% of the overall weight of the transaction card, and in animplementation, the weight of the tungsten member 10 may represent lessthan about 80% of the overall weight of the transaction card. In anembodiment, the overall weight of the transaction card may be at leastabout 10 g, and in an implementation, the overall weight of thetransaction card may be at least about 15 g. In an embodiment, theoverall weight of the transaction card may be at least about 25 g, andin an application, the overall weight of the transaction card may beless than about 20 g. Traditional plastic transaction cards maytypically weigh between 4.5 g and about 5.2 g. Accordingly, in anembodiment, a weighted transaction card comprising a tungsten member 10may weigh at least about two times a traditional plastic transactioncard, and in a preferred embodiment, the weighted transaction card mayweigh at least 3 times. In an application, the weighted transaction cardmay weigh less than about five times a traditional plastic transactioncard.

In an embodiment, the transaction card may have a substantially evenweight distribution across at least a portion of a first dimension(e.g., a length of the card). For instance, the card may have asubstantially even weight distribution across at least about 60% of thelength of the card. In a more preferred embodiment, the card may have asubstantially even weight distribution across at least about 80% of thelength of the card. Additionally, the transaction card may have asubstantially even weight distribution across at least a portion of asecond dimension (e.g., a width of the card). For instance, the card mayhave a substantially even weight distribution across at least about 60%of the width of the card. In a more preferred embodiment, the card mayhave a substantially even weight distribution across at least about 80%of the width of the card. The tungsten member 10 may be shaped, sized,and/or positioned relative to the transaction card so that the center ofmass of the tungsten member 10 coincides with the centroid of thetransaction card.

Additionally, it may be appreciated that a transaction card including atungsten member 10 may be have a weight distribution that issubstantially balanced at least along one dimension of the card. Forexample, the tungsten member 10 may be sized, shaped, and/or disposed tohave symmetric weight distribution along a dimension of the transactioncard. For instance, the weight of a first portion of the card along afirst half (e.g., a left side) of a dimension (e.g., a lengthcorresponding with the largest dimension of the transaction card) may besubstantially the same as the weight of the transaction card along aportion of the card along a second half (e.g., a right side) of adimension. By substantially the same, the weight of the first half maybe no less than about 40% and not more than about 60% of the totalweight of the card. The dimension may be the length, width, or thicknessof the card. In this regard, the transaction card may have relativelyuniform weight along the length of the card. In an embodiment (e.g.,where the tungsten member 10 is disposed in nonoverlapping relativerelation to a machine readable field), the transaction card may have aweight balance that is nonsymetric along another dimension of the card(e.g., along the width). That is, a first half of the card along a width(e.g., the top) of the card may be lighter than a second half of thecard along a width (e.g., the bottom). However, this imbalance of weightalong the width may not affect the weight distribution along the length,such that the weight distribution as determined along the length isstill balanced along the length.

Further still, a weighted transaction card including the tungsten membermay be more rigid than a traditional plastic transaction card. That is,a weighted transaction card may deflect a lesser amount for any givenforce applied to the weighted card. The amount of flexibility of a cardmay be quantified in a number of ways. In a first regard, the card maybe secured along one side thereof (e.g., along a short side of the cardcorresponding to the width or along a long side of the cardcorresponding to length). A force may then be applied at an end of thecard opposite end of the secured edge. In turn, the amount of deflectionof the card may be measured once the force is applied to quantify theflexibility of the card. In another method of quantifying theflexibility of the card, the card may be exposed to an axial load in thedimension corresponding to the card length or an axial load in thedimension corresponding to the card width. This may result in the cardbowing. The amount of deflection of the card (i.e., the distance whichthe card bows) may be measured as a deflection. In either of theforegoing methods, a weighted transaction card may undergo less of adeflection for a given force in such a test than a traditional plastictransaction card. In an embodiment, for a given test, the weightedtransaction card may undergo a reduction in deflection of at least about30% from the deflection of a traditional plastic transaction card, andin an application, the weighted transaction card may undergo a reductionin deflection of at least about 40% from the deflection of a traditionalplastic transaction card. In an application, for a given test, theweighted transaction card may undergo a reduction in deflection of lessthan about 90% from the deflection of a traditional plastic transactioncard, and in an application, the weighted transaction card undergo areduction in deflection of less about 80% from the deflection of atraditional plastic transaction card.

In a characterization, the weighted card may be deflectable, e.g.,substantially elastically deformable, between a planar configuration andan arcuate configuration along at least a portion of a length of thecard (e.g., corresponding with the longitudinal axis thereof), whereinthe arcuate configuration has a radius of curvature of about 68 mm (2.7in) or less. In an implementation, the weighted card may be deflectable,e.g., substantially elastically deformable, between a planarconfiguration and an arcuate configuration along at least a portion of awidth of the card (e.g., corresponding with a cross-axis that istransverse, e.g., normal, to the longitudinal axis of the card), whereinthe arcuate configuration has a radius of curvature of about 68 mm (2.7in) or less.

In an embodiment, the weighted card may be deflectable, e.g.,substantially elastically deformable, through an angle of at least about3° per 5.1 mm (0.2 in), and preferably at least about 4.5° per 5.1 mm(0.2 in), along a length of the card (e.g., corresponding with thelongitudinal axis thereof). In the same or other embodiments, theweighted card may be deflectable, (e.g., substantially elasticallydeformable) through an angle of at least about 5° per 5.1 mm (0.2 in),and preferably at least about 7.5° per 5.1 mm (0.2 in), along a width ofthe card (e.g., corresponding with a cross-axis that is transversely,e.g., normal to the longitudinal axis of the card). In animplementation, the weighted card may be deflectable, e.g.,substantially elastically deformable, through an angle of less thanabout 20° per 5.1 mm (0.2 in), along a length of the card (e.g.,corresponding with the longitudinal axis thereof), and preferably lessthan about 18.5° per 5.1 mm (0.2 in), along a length of the card (e.g.,corresponding with the longitudinal axis thereof). In the same or otherembodiments, the weighted card may be deflectable, (e.g., substantiallyelastically deformable) through an angle of less than about 15° per 5.1mm (0.2 in), and preferably less than about 12° per 5.1 mm (0.2 in),along a width of the card (e.g., corresponding with a cross-axis that istransversely, e.g., normal to the longitudinal axis of the card).

With further reference to FIG. 3, a film layer 40 may be applied to thesurround 22 and the tungsten member 10 inlaid with respect to thesurround 22 to further secure the tungsten member 10 within the opening20. For example, the film layer 40 may assist in a lamination process aswill be described in greater detail below. The film layer 40 may be, forexample, a polyester, polyvinyl chloride (PVC), polypropylene,polyethylene, acrylic, polycarbonate, and/or the like. The film layer 40maybe, but is not required to be, transparent. The assembly includingthe tungsten member 10 inlaid and encapsulated within the opening 20 ofthe sheet 22 and the film layers 40 applied thereto may be referred toas inlay 100.

In this regard, with further reference to FIG. 4, a cross sectional viewof the inlay 100 is shown along the boundary between the tungsten member10 and the surround 22. In this regard, it may be appreciated that theopening 20 of the surround 22 may be sized so as to provide some spacebetween the tungsten member 10 and the surround 22. This space may befilled with the encapsulant 30 to secure the tungsten member 10 in theopening 20. While not shown in FIG. 4, as described above in someembodiments, the encapsulant 30 may substantially surround the tungstenmember 10 (i.e., extend along all sides thereof) such that a layer ofencapsulant 30 may also extend along the tungsten member 10 between thefilm layer 40 and the tungsten member 10.

Turning to FIG. 5, the inlay 100 may be provided between a graphics 210layer and a second graphics layer 220. That is, the first graphics layer210 may be disposed adjacent to a first side of the inlay 100 and thesecond graphics layer 220 may be disposed adjacent to a second side ofthe inlay 100. The first graphics layer 210 and/or the second graphicslayer 220 may be printable layers onto which graphics (e.g., logos,designs, photos, etc.) may be printed. Such graphics may be printedusing any known printing technique known in the art such as, forexample, screen printing, Gravure printing, lithography, inkjetprinting, laser printing, etc. Of note, the graphics layers 210 and 220may be printed or otherwise produced using traditional high volume cardproduction techniques. The second graphics layer 220 may include agraphics field 222 (e.g., containing terms and conditions or otherindicia associated with the finalized transaction card).

Furthermore, the inlay 100, the first graphics layer 210, and the secondgraphics layer 220 may be disposed between a first transparent filmlayer 230 and a second transparent film layer 240. The first transparentfilm layer 230 may include graphics and/or data fields corresponding tothe finished transaction card. For example, as shown in FIG. 5, anaccount number 212, an account owner data field 214, one or moreauthenticity indicia 216 (e.g., holograms or the like), and/or agraphics field 218 may be printed or otherwise disposed (e.g., appliedby way of adhesive or the like) on the first transparent film layer 230.In this regard, the first transparent film layer 230 may includepersonalization or the like related to a card account and/or card owner.Note that the personalization may be provided via traditional highvolume production techniques such as any of the foregoing printingtechniques, hot stamping, application of holograms, etc. The secondtransparent film layer 240 may include a machine readable field 242and/or a signature field 244 printed thereon. The machine readable field242 may be written with data corresponding to, for example, indiciaindicative of an account to which the transaction card is associated orother information related to the transaction card. The signature field244 may provide a surface on which the user of the card may write (e.g.,to sign the card as part of a verification process).

With further reference to FIG. 6, the first transparent film layer 230,the first graphics layer 210, the inlay 100, the second graphics layer220, and the second transparent film layer 240 may be disposed into alamination press 300. The lamination press 300 may include first andsecond platens 310 between which the various layers are disposed. Theplatens 310 may include different surface finishes that face the layersstack (e.g., including the transparent film layers 230 and 240, thegraphics layers 210 and 220 and the inlay 100) so as to apply a surfacefinish to the transaction card upon completion of the lamination. Forexample, a mirrored finish (resulting in a gloss finish on the card) ora satin finish (resulting in a satin finish on the card) may be providedon the platens 310. It may be appreciated that a satin finish may bepreferred in at least some embodiments. In this regard, the satin finishon the finished transaction card may reduce the likelihood that“ghosting” of the tungsten member 10 is visible on the exterior surfacesof a finished transaction card. That is, a slightly rougher surface(e.g., a non-glossy surface) may result in any ghosting that may occurwith respect to the tungsten member 10 being minimized. In this regard,the surface finish of the finished transaction card may be not less thanabout 0.15 micrometers (6 microinches) and not more than about 0.403micrometers (15.9 microinches). Additionally or alternatively, one ormore different finishes may be provided on the platens 310 (e.g.,including the incorporation of designs or the like by altering thefinishes on a given portion of the platen 310).

In any regard, heat and pressure may be applied to the platens 310 inthe direction of arrows 320 such that the layer stack becomes laminated.That is, the application of heat and pressure to the first transparentfilm layer 230, the first printable layer 210, the inlay 100, the secondprintable layer 220, and the second transparent film layer 240 mayresult in the lamentation of the various layers resulting in a finishedcard body. The hot lamination process may include one or more phases ofapplication of heat and/or pressure. For example, during a first phase aconstant temperature may be applied to the layer stack at a constantpressure. During a second phase, a constant temperature (e.g., lowerthan the temperature of the first phase) may be applied and the pressuremay be continuously or periodically increased during the second phase.Additional phases including different and/or variable temperaturesand/or pressures may be applied to laminate the layer stack.

While the foregoing process focused on the production of a singletransaction card, it will be appreciated that the process describedabove may be completed in a bulk manner. In this regard, with furtherreference to FIG. 7, the inlay 100 may include a plurality of portionscorresponding to individual finished transaction cards. In this regard,the plurality of portions corresponding to individual cards may undergothe foregoing process and be later separated (e.g., by way of cutting orpunching out the individual card portions). Accordingly, as shown inFIG. 7, a plurality of tungsten members 10 may be inlaid with respect toa plurality of openings 20 of a surround 22. Accordingly, the surround22 may receive a plurality of tungsten members 10 that may eachcorrespond to an individual card portion. The inlay 100 including theplurality of individual card portions may be processed similarly asdescribed above (i.e., disposed between first and second graphics layers210 and 220 as well as first and second transparent film layers 230 and240) and laminated in a bulk operation. In this regard, the first andsecond graphics layers 210 and 220 as well as first and secondtransparent film layers 230 and 240 may also have individual cardportions including the features described above in relation to eachlayer for each individual card portion. Accordingly, once the inlay 100including the plurality of individual card portions has undergone thelamination process, the individual finished cards may be separated fromthe resulting bulk card sheet. For example, a sheet including 28 or 56card portions may be provided.

In an implementation, a transaction card may be provided that includesan inset device. The inset device may include, for example, a smart cardchip or the like. In an implementation, the inset device may be an EMVchip, a Mifare chip, or other inset device provided on the card. It willbe appreciated that when integrating inset devices with transactioncards, the card may be milled to provide a pocket. Accordingly, asdepicted in FIG. 9, the tungsten member 10 may include a relief portion12. The relief portion 12 may provide a space in which a pocket may bemilled in a finished card to accommodate an inset device. In thisregard, the relief portion 12 of the tungsten member 10 may be sized andpositioned so as to avoid any portion of the tungsten member 10interfering with the milling process. As shown in FIG. 9, encapsulant 30may be provided in the space defined by the relief portion 12. In animplementation depicted in FIG. 10, the surround 22 may include aprojection 24 that extends into the space defined by the relief portion12. In any regard, as shown in FIG. 11, a pocket 26 may be milled toaccommodate in inset device (e.g., an EMV chip). While the pocket 26 isshown in FIG. 12 as being milled into the projection 24 of the surround22, it may also be appreciated that the encapsulant 30 disposed in thespace defined by the relief portion 12 may also be milled. Furtherstill, while the inlay 100 is shown as being milled in FIG. 11, this maybe for illustration purposes only. In this regard, it may be appreciatedthat the finished transaction card (e.g., after lamination) may bemilled such that additional layers are milled that are not shown in FIG.11. In this regard, an inset device may be disposed in the pocket 26.

FIG. 12 shows an embodiment of an inlay 100 where a relief portion 12 isprovided that comprises an opening in the tungsten member 10. That is,the relief portion 12 shown in FIG. 12 may be provided such that thetungsten member 10 surrounds the relief portion 12. In this regard, therelief portion 12 need not be positioned at an edge of the tungstenmember 10. The relief portion 12 may be filled with encapsulant 30 andsubsequently milled to produce a pocket 26 for receiving an insetdevice. Alternatively, a plug or other portion of material (e.g., asimilar material to that of surround 22) may be provided in the reliefportion 12 that is milled to produce the pocket 26.

Further still, with reference to FIG. 13, the inlay 100 may be providedwith an antenna 28 (e.g., to facilitate wireless or contactlesscommunication with a finished transaction card). With further referenceto FIGS. 14A and 14B, various embodiments of the positioning of theantenna 28 relative to the inlay 100 are shown. For example, as shown inFIG. 14A, the antenna 28 may be disposed on a surface of the surround22. In this regard, the antenna 28 may be provided directly on thesurface of the surround 22 (e.g., by way of a deposition process or viaan adhesive). While not shown, the antenna 28 may be provided on a layerthat extends relative to the inlay 100 (e.g., the antenna 28 andassociated substrate may form a layer of the card).

Additionally, as shown in FIG. 14B, the antenna 28 may be inset relativeto the surround 22. In this regard, the surround may be formed orprocessed to include a recess that accommodates the antenna 28. Therecess may be milled from the surround 22. In this regard, the antenna28 may be provided at least partially inset into the surround 22 suchthat the antenna 28 may not add to the thickness of the finished card.

Additionally, with reference to FIG. 15, it may be appreciated that in afinished transaction card, an edge of a surround 22 may be at leastpartially exposed at an edge of the transaction card. That is, thelayers of the first graphics layer 210, the surround 22, and the secondgraphics layer 220 may each be visible at an edge of the finishedtransaction card. In this regard, it may be appreciated that the colorsof these layers may be selected to match or contrast. For example, in anembodiment, the color of the surround 22 may be chosen to contrast fromat least one of the first graphics layer 210 or the second graphicslayer 220 so that the contrasting color of the surround 22 may bevisible at a portion of the edge of the finished card. In otherembodiments, the color of the surround 22 may be chosen to match thecolor of at least one of the first graphics layer 210 or the secondgraphics layer 220 such that the visible portion of the surround 22 atthe edge of the finished transaction card may match the edge color ofthe first graphics layer 210 or the second graphics layer 220.

In an embodiment, the graphics layers 210 and/or 220 and the surround 22may be substantially opaque. In this regard, in an embodiment of thetransaction card, the tungsten member 10 may not be visible at anexterior of the card. That is, the tungsten member may be completelyencapsulated by opaque portions such that the tungsten member is notvisible.

In another embodiment, the transaction card may include a transparent ortranslucent portion so that at least a portion of the tungsten member 10is visible at an exterior of a transaction card including the tungstenmember. As such, with reference to FIG. 17, a front side of a card isshown such that a graphics layer 210 is visible. The graphics layer 210may include a transparent portion 250. In this regard, the tungstenmember 10 may be visible through the transparent portion 250. As may beappreciated, the transparent portion 250 may be disposed some distancefrom the edge of the graphics layer 210. That is, the transparentportion 250 may include a border 260 surrounding the transparent portion250. In this regard, the border 260 may be substantially opaque. Assuch, the border 260 may cover an interface between the tungsten member10 and the surround 22. In this regard, an edge portion of the tungstenmember 10 may be obscured by the border 260. As may be appreciated, ifthe tungsten member 10 includes a surface roughness (e.g., a textured,potentially decorative surface roughness), the surface roughness may bevisible through the transparent portion 250. While one side (e.g.,corresponding to the first graphics layer 210) is shown, it may beappreciated that such a transparent portion 250 may be provided oneither or both sides of a transaction car.

Reference is now made to FIGS. 18-20 which illustrate another embodimentof an inlay 100 where a relief portion 12 of a metallic member 10 thatprovides a space for a pocket (e.g. a transaction card pocket forreceiving an inset device that includes a smart card chip) is defined byan opening 12 a that extends through the metallic member 10, with anon-metallic plug 14 (e.g. comprising a polymer-based material) disposedin the opening 12 a of the relief portion 12. In one approach, the plug14 and the opening 12 a of the relief portion 12 may be sized tofacilitate press-fit insertion of the plug 14 in to the opening 12 a. Inturn, the metallic member 10, together with the inserted plug 14, may bedisposed in an opening 20 of a non-metallic surround 22 (e.g. comprisinga polymer-based material). In one approach, the opening 20 of thesurround 22 and the metallic member 10 may be sized to facilitatepress-fit insertion of the metallic member 10 in to the opening 20 ofthe surround 22.

As shown in FIG. 19, after positioning of the plug 14 in the opening 12a of the relief portion 12, and positioning of the metallic member 10within the opening 20 of the surround 22, an antenna 28 may be providedon the surround 22 so as to extend about the opening 20 thereof. Inparticular, a first portion 28 a of antenna 28 may extend around theopening 20 a plurality of times (e.g. to define a plurality of outerloops). Further, a second portion 28 b of the antenna 28 may be disposedon and extend about a peripheral portion of the plug 14. In that regard,the second portion 28 b of the antenna 28 may be provided on plug 14 sothat, upon subsequent provision of a transaction card pocket (a portion26 a of which is shown with phantom lines in FIG. 19) for receiving aninset device (e.g. an integrated circuit (IC) chip module having a smartcard chip and electrically interconnected antenna), the second portion28 b may extend about the pocket a plurality of times (e.g. to define aplurality of inner loops).

With further reference to FIG. 19, the first portion 28 a and secondportion 28 b of antenna 28 may be electrically interconnected by anintermediate portion 28 c of antenna 28 extending therebetween. In thatregard, the antenna 28 may be defined by a continuous length of metalthat extends from a free end about the opening 20 of surround 22 (e.g.to define a first section of the first portion 28 a), then extends tothe plug 14 (e.g. to define a first section of the intermediate portion28 c), then extends about the plug 14 (e.g. to define the second portion28 b), then extends back to the surround 22 (e.g. to define a secondsection of the intermediate portion 28 c), then extends about theopening 20 of surround 22 to another free end (e.g. to define a secondsection of the first portion 28 a). In some implementations, the entirefirst portion 28 a of antenna 28 may be disposed at least 2 mm (79 mils)inward from an outer periphery of the surround 22, and at least 1 mm (39mils) outward from an outer periphery of the metallic member 10.

In some embodiments, the antenna 28 may comprise a metal wire (e.g. acopper wire) that may have an electrically non-conductive coatingprovided thereupon (e.g. a lacquer or shellac coating), and that may beof a relatively small diameter (e.g. about 0.08 mm (3 mils) to about0.15 mm (6 mils)). In such embodiments, the metal wire of antenna 28 maybe partially inset relative to the surface of surround 22, andoptionally, relative to the surface of plug 14. For example, the metalwire may be partially embedded (e.g. about 30% to 60% of the wirediameter may be inset), via an ultrasonic or laser embedding procedure.As further shown in FIGS. 18 and 19, the metallic member 10 may includea pair of grooves 10 a extending partially or completely through themetallic member 10, wherein corresponding first and second sections ofthe intermediate portion 28 c of antenna 28 may be disposed within thegrooves 10 a.

As shown in FIG. 20, after the provision of antenna 28, as described inrelation to FIG. 19, the inlay 100 may be provided with film layers 40on opposing sides of and in face-to-face relation with the surround 22,metallic member 10 and plug 14. The film layers 40 may comprise apolymer-based material, e.g. a polyester, polyvinylchloride (PVC),polypropylene, polyethylene, acrylic, polycarbonate, and/or likematerial. In one approach, the film layers 40 may be attached to thesurround 22, metallic member 10 and plug 14 via polymer-based adhesivelayers. As further described herein, the inlay 100 of FIGS. 18-20 may beprovided as one of a plurality of inlays comprising an inlay sheet layerthat may be interconnected to additional sheet layers to define amulti-layer assembly from which a corresponding plurality of card bodiesmay be separated for subsequent processing (e.g. pocket formation, insetdevice placement, pre-personalization procedures, and personalizationprocedures including the provision of visible account indicia andencoding of a smart card chip and/or magnetic stripe with uniqueaccount-related data).

Reference is now made to FIGS. 21-23 which illustrate another embodimentof an inlay 100 where a relief portion 12 of a metallic member 10 thatprovides a space for a pocket (e.g. a transaction card pocket forreceiving an inset device that includes a smart card chip) is defined byan edge recess 12 b, or notch, that is provided at an outer edge of themetallic member 10, with a projection 24 of a non-metallic surround 22(e.g. comprising a plastic polymer-based material) that extends in tothe recess 12 b of the relief portion 12. In one approach, an opening 20and the projection 24 of the surround 22, and the metallic member 10 andedge recess 12 b thereof, may be sized to facilitate press-fit insertionof the metallic member 10 in to the opening 20 of the surround 22.

As shown in FIG. 22, after positioning of the metallic member 10 withinthe opening 20 of the surround 22, with projection 24 disposed in theedge recess 12 b of metallic member 10, an antenna 28 may be provided onthe surround 22 so as to extend about the opening 20 thereof. Inparticular, a first portion 28 a of antenna 28 may extend around theopening 20 on a peripheral portion of surround 22 a plurality of times(e.g. to define a plurality of outer loops). Further, a second portion28 b of the antenna 28 may be disposed on and extend about a peripheralend portion of the projection 24 of surround 22 a plurality of times(e.g. to define a plurality of inner loops). In that regard, the secondportion 28 b of the antenna 28 may be provided on projection 24 so that,upon subsequent provision of a transaction card pocket (a portion 26 aof which is shown with phantom lines in FIG. 22) for receiving an insetdevice (e.g. an integrated circuit (IC) chip module having a smart cardchip and electrically interconnected antenna), the second portion 28 bmay extend about the pocket a plurality of times (e.g. to define aplurality of inner loops).

With further reference to FIG. 22, the first portion 28 a and secondportion 28 b of antenna 28 may be electrically interconnected by anintermediate portion 28 c of antenna 28 extending therebetween. In thatregard, the antenna 28 may be defined by a continuous length of metalthat extends from a free end about the opening 20 of surround 22 (e.g.to define a first section of the first portion 28 a), then extends alongthe projection 24 (e.g. to define a first section of the intermediateportion 28 c), then extends about a peripheral end portion of projection24 (e.g. to define the second portion 28 b), then extends back alongprojection 24 to the peripheral portion of surround 22 (e.g. to define asecond section of the intermediate portion 28 c), then extends about theopening 20 of surround 22 to a second free end (e.g. to define anothersection of the first portion 28 a).

In one embodiment, the antenna 28 may comprise a metal wire (e.g. acopper wire) that may have an electrically non-conductive coatingprovided thereupon (e.g. a lacquer or shellac coating), and that may beof a relatively small diameter (e.g. about 0.08 mm (3 mils) to about0.15 mm (6 mils)). In such embodiments, the metal wire of antenna 28 maybe partially inset relative to the surface of surround 22 and/orprojection 24 thereof. For example, the metal wire may be partiallyembedded (e.g. about 30% to 60% of the wire diameter may be inset), viaan ultrasonic or laser embedding procedure.

As shown in FIG. 23, after the provision of antenna 28, as described inrelation to FIG. 22, the inlay 100 may be provided with film layers 40on opposing sides of and in face-to-face relation with the surround 22and metallic member 10. The film layers 40 may comprise a polymer-basedmaterial, e.g. a polyester, polyvinylchloride (PVC), polypropylene,polyethylene, acrylic, polycarbonate, and/or like material. In oneapproach, the film layers 40 may be attached to the surround 22 andmetallic member 10 via polymer-based adhesive layers.

As further described herein, the inlay 100 of FIGS. 21-23 may beprovided as one of a plurality of inlays comprising an inlay sheet layerthat may be interconnected to additional sheet layers to define amulti-layer assembly from which a corresponding plurality of card bodiesmay be separated for subsequent processing (e.g. pocket formation, insetdevice placement, pre-personalization procedures, and personalizationprocedures including the provision of visible account indicia andencoding of a smart card chip and/or magnetic stripe with uniqueaccount-related data).

Reference is now made to FIG. 24 which illustrates another embodiment ofan inlay 100 that is the same as the inlay 100 described above inrelation to FIGS. 21-23, except that antenna 28 includes only a firstportion 28 a and an intermediate portion 28 c, and does not include asecond portion 28 b as described in relation to FIGS. 21-23. Rather, inthe embodiment shown in FIG. 24, the two sections of intermediateportion 28 c terminate and may be directly electrically interconnectedto different, corresponding electrically-conductive contact pads 29provided in spaced relation on an end portion of projection 24 of thesurround 22. In turn, upon subsequent provision of a transaction cardpocket (a portion 26 a of which is shown with phantom lines in FIG. 24)and an inset device therein (e.g. an integrated chip (IC) module havinga smart card chip and two electrically interconnected contacts), thecontact pads 29 may be directly electrically interconnected to the insetdevice (e.g. interconnected to contacts of an IC chip module that areinterconnected to a smart card chip).

Reference is now made to FIGS. 25 and 26 which illustrate an embodimentof a transaction card 401 having a length and a width (e.g. a length,width and thickness in compliance with ISO/IEC Standard 7810). Thetransaction card 401 may include an inlay 100 as described above. Theinlay 100 may extend from edge-to-edge across a length L and width W ofthe transaction card 401. Further, transaction card 401 may include afirst graphics layer 410 interconnected to a first side of the inlay 100and extending from edge-to-edge across the length L and the width W ofthe transaction card 401, and a second graphics layer 420 interconnectedto a second side of the inlay 100 and extending from edge-to-edge acrossthe length L and the width W of the transaction card 401. The firstgraphics layer 410 may be opaque or transparent, and may be providedwith printing 412 on an outward-facing side, wherein the printing 412 isvisible through a first side of the transaction card 401, as shown inFIG. 25. Similarly, the second graphics layer 420 may be opaque ortransparent and may be provided with printing 422 on an outward-facingside thereof, wherein the printing 422 is visible through a second sideof the transaction card, as shown in FIG. 26.

The printing provided on the outward-facing side of the first graphicslayer 410 and/or on the outward-facing side of the second graphics layer420 may be forward-printed and may comprise one or more of graphics(e.g. a pictorial scene, a logo, a photo, etc.), human-readablecharacters (e.g. numbers, letters, and/or representations thereof),and/or one or more machine-readable markings (e.g. a bar code, amulti-dimensional matrix code, etc.). In some embodiments, printing maybe provided exclusively on the outward-facing side of the first graphicslayer 410 and/or on the outward-facing side of the second graphics layer420, with no printing on the inward-facing side of the first graphicslayer 410 and/or on the inward-facing side of the second graphics layer420. Alternatively or additionally, in some embodiments, reverseprinting may be provided on the inward-facing side of a transparentfirst graphics layer 410 and/or on the inward-facing side of atransparent second graphics layer 420.

The printing 412 and/or printing 422 may comprise ink printing. By wayof example, printing 412 on the outward-facing side of the firstgraphics layer 410 and/or printing 422 on the outward-facing side of thesecond graphics layer 421 may be provided by screen printing, Gravureprinting, lithography, inkjet printing, or other high volume inkprinting techniques.

As further shown in FIG. 25, visible indicia 440 a, 440 b may beprovided on the transaction card 401, wherein the visible indicia 440 acomprises data corresponding with and indicative of an account uniquelyassociated with the transaction card 401, e.g. a payment accountadministered by or on behalf of card issuer payment institution. Forexample, the visible indicia 440 a may comprise, human-readablecharacters indicative of a corresponding account (e.g. an accountnumber). Further, visible indicia 440 b may include additionalhuman-readable data corresponding with the given account, including acorresponding card expiration date, a corresponding account servicegrade level, and/or corresponding customer-specific data (e.g. customername, customer duration data, etc.). In FIG. 25, visible indicia 440 a,440 b are provided for viewing from the first side of the transactioncard 401. In other embodiments, visible indicia 440 a and/or 440 b maybe also or alternatively provided for viewing from the second side ofthe transaction card 401. Visible indicia 440 a, 440 b may be providedon transaction card 401 as a part of card personalization procedures.

As shown in FIG. 25, transaction card 401 may also include a pocket 26defined in the first side of the transaction card 401. In turn, aplurality of contact pads 444 and an underlying integrated circuit (IC)chip 446 (e.g. a smart card chip shown by phantom lines) andelectrically interconnected antenna 448 (i.e. one or more metal loopsshown by phantom lines) may be disposed within the pocket 26, whereinthe contact pads 444 and IC chip 446 may be provided for contact with achip card reader device for signal transmissions therebetween (e.g. incompliance with ISO/IEC Standard 7816) to complete a financialtransaction (e.g. at an ATM location, a point-of-sale location, etc.).In one approach, the contact pads 444 may be supportably interconnectedto a top side of a substrate, and the IC chip 446 and electricallyinterconnected antenna 448 may be supportably interconnected to a bottomside of the same substrate as part of an assembled IC chip module thatmay be positioned and secured within pocket 26 (e.g. via an adhesive ina single operation). The antenna 448 may be provided for inductivecoupling with the second portion 28 b of the antenna 28 of the inlay 10described in relation to FIGS. 18-20 or FIGS. 21-23 above. In turn, theantenna 448 and IC chip 446 may be provided for contactless interfacewith a contactless card reader (e.g. in compliance with ISO/IEC Standard14443). The IC chip 446 may be encoded during card personalization withdata corresponding with the account indicated by visible indicia 440 a.Optionally, an elite brand mark 441 (e.g. indicative of a specificpayment network or card association) may be affixed to the first side ofthe transaction card 401.

With further reference to FIG. 26, transaction card 401 may also includea magnetic stripe 443 affixed to the second side of transaction card401. The magnetic stripe 443 may be encoded during card personalizationwith data corresponding with the account indicated by visible indicia440 a (e.g. in compliance with ISO/IEC Standard 7811). As further shownin FIG. 26, a signature block 445 and/or hologram 447 may also beaffixed to the second side of the transaction card 401 (e.g. viahot-stamping).

Reference is now made to FIG. 27 which illustrates a cross-sectionalview of the transaction card 401 shown in FIG. 25, with an inlay 100 asshown in FIGS. 21-23, wherein the cross-sectional view is taken alongsection line AA shown in FIG. 25. As illustrated, the transaction card401 may include the inlay 100, the first graphics layer 410 and secondgraphics layer 420 on opposing sides of the inlay 100, and a first filmlayer 460 interconnected to an outward-facing side of the first graphicslayer 410 and second film layer 462 interconnected to an outward-facingside of the second graphics layer 420. As described in relation to FIGS.21-23, the inlay 100 may include a metallic member 10 located within anopening of a surround 22 that includes a projection 24. Further, theinlay 100 may include an antenna 28 having a first portion 28 a and asecond portion 28 b defined by a continuous length of metal (e.g. ametal wire partially embedded in a surface of surround 22 and projection24 thereof). Further, the inlay 100 may include outer film layers 40, asdescribed in relation to FIGS. 21-23.

As further illustrated in FIG. 27, the transaction card 401 may includea pocket 26 having an IC chip module 480 disposed therein. The IC chipmodule 480 may include a plurality of contact pads 444 supportablyinterconnected to a top side of a substrate 482, and an IC chip 446 andan electrically interconnected antenna 448 supportably interconnected toa bottom side of substrate 482. The contact pads 444 may be electricallyinterconnected through substrate 482 to IC chip 446 to provide forcontact signal transmission between a contact card reader and the ICchip 446 (e.g. in compliance with ISO/IEC Standard 7016). The antenna448 and the second portion 28 b of the antenna 28 of the inlay may bedisposed in overlapping, or at least partially overlapping, and spacedrelation to facilitate inductive coupling therebetween to provide forcontactless RF signal transmission between a contactless card reader andthe IC chip 446 (e.g. in compliance with ISO/IEC Standard 14443).

As illustrated in FIG. 27, the IC chip module 480 may be secured withinpocket 26 via an adhesive 490. In that regard, the pocket 26 may includea first portion that extends entirely through the first film layer 460,the first graphics layer 410, the inlay 100 and in to a portion of thesecond graphics layer 420, and a second portion that extends through thefirst film layer and at least a portion of the first graphics layer 710.The second portion may be of a ring-shaped configuration that adjoinsand extends about the first portion. As such, a ring-shaped shelf 492may be defined at the bottom of the second portion of the pocket 26,wherein the adhesive 490 may be provided on the shelf 492 and in contactwith at least a ring-shaped portion of a bottom side of the IC chipmodule 480 and substrate 482 thereof. In another arrangement thatutilizes the inlay of FIG. 24, the second portion 28 b of the antennamay be replaced by contact pads 29, and electrically conductive membersmay be provided that extend between the contact pads 29 and contactsthat are supported on the bottom side of substrate 482 and electricallyinterconnected to the IC chip 446. In contactless-only arrangements, anIC chip module 480 may be provided in pocket 26 without contact pads444, wherein the IC chip 446 may be electrically interconnected tocontacts of the IC chip module 480 that are electrically coupled toantenna 28 (e.g. inductively coupled via an antenna 448 or directlycoupled via electrically conductive members) for RF signal transmissionto/from a contactless card reader.

Reference is now made to FIG. 28 which illustrates various additionallayers of a card body comprising the transaction card 401, wherein thethicknesses of such layers are exaggerated in relation to the length Land width W dimensions of the transaction card 401. As shown, inaddition to the inlay 100, first graphics layer 410, and second graphicslayer 420, the transaction card 401 may include a first innerpolymer-based adhesive layer 450 disposed between and interconnectingthe with inlay 100 and the inward-facing side of the first graphicslayer 410. Similarly, a second inner polymer-based adhesive layer 452may be disposed between and interconnecting the inlay 100 and theinward-facing side of the second graphics layer 420. In one approach,the first inner polymer-based adhesive layer 450 may be provided as athermosetting coating (e.g. a thermosetting resin) applied to a firstside of the inlay 100, and the second inner polymer-based adhesive layer452 may be provided as a thermosetting coating (e.g. a thermosettingresin) applied to a second side of the inlay 100. In another approach,the first inner polymer-based adhesive layer 250 and/or the second innerpolymer-based adhesive layer 452 may be provided as a coating applied toan inward-facing side of the first graphics layer 410 and/or to aninward-facing side of the second graphics layer 420, respectively.

As further shown in FIG. 28, transaction card 401 may include a firstfilm layer 460 interconnected to an outward-facing side of the firstgraphics layer 410 and extending from edge-to-edge across the length Land the width W of the transaction card 401, and a second film layer 462interconnected to an outward facing side of the second graphics layer420 and extending from edge-to-edge across the length L and the width Wof the transaction card 401. The first film layer 460 and/or the secondfilm layer 462 may be transparent to facilitate the viewing of printing412 and/or printing 422 that may be provided on the first graphics layer410 and/or second graphics layer 420, respectively, as discussed above.The second film layer 462 may be provided with a magnetic stripe on anoutward-facing side thereof.

Additionally, and as further shown in FIG. 28, transaction card 401 mayinclude a first outer thermoset layer 454 disposed between andinterconnecting the first graphics layer 410 and an inward-facing sideof the first film layer 460. Similarly, a second outer thermoset layer456 may be disposed between and interconnecting the second graphicslayer 420 and the inward-facing side of the second film layer 462. Inone approach, the first outer thermoset layer 454 may be provided as athermosetting coating (e.g. a thermosetting adhesive) applied to aninward-facing side of the first film layer 460, and the second outerthermoset layer 456 may be provided as a thermosetting coating (e.g. athermosetting adhesive) applied to an inward-facing side of the secondfilm layer 462. In another approach, the first outer thermoset layer 454may be provided as a thermosetting coating (e.g. a thermosettingadhesive) applied to an outward-facing side of the first graphics layer410, and the second outer thermoset layer 456 may be provided as athermosetting coating (e.g. a thermosetting adhesive) applied to anoutward-facing side of the second graphics layer 420.

The inlay 100 and additional layers described in relation to FIGS. 25-28may be assembled in stacked relation to establish interconnectionstherebetween to provide the transaction card 401. For example, afterstacked assembly of the layers, and prior to the provision of thevisible indicia 440 a, 440 b, pocket 26, contact pads 444, IC chip 446,antenna 448, elite brand mark 441, signature block 445 and hologram 447,the assembled layers may be heated under pressure to a predeterminedtemperature range across the assembly of layers, wherein thepolymer-based adhesive layers 450, 452, and thermoset layers 454 and 456are activated, or cured, so as to fixedly interconnect the correspondingadjacent layers between which such thermoset layers 450, 452, 454 and456 are disposed. The predetermined temperature range across theassembly of layers may be established to comprise temperatures lowerthan softening temperatures of the inlay 100 (e.g. surround 22), firstgraphics layer 410, second graphics layer 420, first film layer 460, andsecond film layer 462. More particularly, the predetermined temperaturerange across the assembly of layers may be from at least about 240°Fahrenheit to no more than, or less than, about 270° Fahrenheit.

In one example, a transaction card 401 may be provided with layershaving the following thicknesses:

first film layer 460 with first outer thermoset layer 454 appliedthereto: about 0.025 mm (1 mil)-0.076 mm (3 mils);

first graphics layer 410: about 0.127 mm (5 mils)-0.152 mm (6 mils);

first inner polymer-based adhesive layer 450: about 0.025 mm (1mil-0.076 mm (3 mils);

inlay 100: about 0.279 mm (11 mils)-0.330 mm (13 mils);

second inner polymer-based adhesive layer 452; about 0.025 mm (1mil)-0.076 mm (3 mils);

second graphics layer 420: about 0.127 mm (5 mils)-0.152 mm (6 mils);

second film layer 462 with second outer thermoset layer 456 appliedthereto: about 0.025 mm (1 mil)-0.076 mm (3 mils).

In conjunction with such example, the metallic member 10 may comprisetungsten, stainless steel or another metal identified herein.

In some embodiments, subsequent to assembly and interconnection of thelayers of the transaction card 401, the visible indicia 440, pocket 26,contact pads 444, IC chip 446 and antenna 448 may be provided asdescribed above. Further, the IC chip 446 and magnetic stripe 443 may beencoded with personalization data, during card personalizationcompletion. Additionally, the optional elite brand mark 441, signaturepanel 445 and hologram 447 may be affixed (e.g. hot-stamped).

In contemplated arrangements, all or at least a portion of the visibleindicia 440 may be defined at an outward-facing surface of the firstfilm layer 460 (e.g. by at least one of laser engraving, ink jetprinting and thermal printing). By way of particular example, visibleindicia 440 may be defined at the outward-facing surface of the firstfilm layer 460 by laser engraving, wherein the first film layer 460 maycomprise a polymer-based material having a laser reactive materialdispersed therein (e.g. carbon particles). When the visible indicia 440is defined by any of laser engraving, ink jet printing andthermo-printing, a carbon containing ink may be utilized for printing onthe first graphics layer 410 and/or second graphics layer 420.Alternatively, in laser engraving embodiments, carbonless ink may beutilized for printing on the first graphics layer 410 and/or secondgraphics layer 420.

In some embodiments, transaction card 401 may be produced as one of acorresponding plurality of transaction cards to realize productionefficiencies. In that regard, reference is now made to FIGS. 29 and 30which illustrate a multi-sheet assembly 500 of multiple sheet layershaving a plurality of sheet regions 501 from which a plurality of cardbodies may be separated and further processed to yield a correspondingplurality of transaction cards, each as described above in relation totransaction card 401. While FIGS. 29 and 30 illustrate the assembly of amulti-sheet assembly 500 having four sheet regions 501 from which fourcard bodies may be separated (i.e. arranged in two rows and twocolumns), a larger multi-sheet assembly may be utilized to yield agreater number of card bodies (e.g. 28 card bodies arranged in 4 rowsand 7 columns).

With specific reference to FIG. 30, a first graphics sheet 510 (e.g.corresponding with first graphics layer 410) and second graphics sheet520 (e.g. corresponding with second graphics layer 420) may be arrangedso that inward-facing sides thereof are located in face-to-face relationto opposing sides of an inlay sheet 100 a (e.g. corresponding with inlay100). Additionally, a first film sheet 560 (e.g. corresponding withfirst film layer 460) and a second film sheet 562 (e.g. correspondingwith second film layer 462) may be arranged so that inward-facing sidesthereof are located in face-to-face relation to outward-facing sides ofthe first graphics sheet 510 and second graphics sheet 520,respectively.

Prior to arranging the multi-sheet assembly 500 as shown in FIG. 30,printing may be provided at each of a plurality of different locations(i.e. in corresponding relation to each of the plurality of sheetregions 501 from which card bodies will be separated) on theoutward-facing side and/or inward-facing side of the first graphicssheet 510 to provide printing 412 as described above in relation to FIG.25. In that regard such printing 412 may be the same for each of thecard bodies to be separated. Similarly, printing may be provided at eachof a plurality of different locations (i.e. in corresponding relation toeach of the plurality of sheet regions 501 from which the card bodieswill be separated) on the outward-facing side and/or inward-facing sideof the second graphics sheet 520 to provide printing 422 as describedabove in relation to FIG. 26. In that regard, such printing 422 may bethe same for each of the card bodies to be separated. Additionally, adifferent magnetic stripe may be provided on an outward-facing side ofthe second film sheet 562 in corresponding relation to each row of theplurality of sheet regions 501 from which card bodies will be separated.As further shown in FIG. 30, the inlay sheet 100 a may include aplurality of inlay regions 101 b and metallic members 10 (shown inphantom lines) disposed within the plurality of sheet inlay regions 101b, in corresponding relation to the plurality of sheet regions 501 fromwhich a plurality of card bodies will be separated. In that regard, eachof the inlay regions 100 b may be of a width and a length that is equalto a length and width of the plurality of sheet regions 501.

Further in that regard, and with reference now to FIGS. 31A, 31B, 31C,31D and 31E, one approach for the construction of inlay sheet 100 a willbe described. In particular, FIGS. 31A and 31B show a metallic sheet 570having a plurality of metallic regions 571 from which a plurality ofmetallic members 10 may be separated. For example, the metallic members10 may be separated from the metallic sheet 570 via milling and/or punchoperations. In the illustrated embodiment, each of the metallic members10 may be of a configuration that corresponds with the inlay 100described above in relation to FIGS. 21-24. In turn, and as shown inFIGS. 31C and 31D, the plurality of metallic members 10 may be locatedin a corresponding plurality of openings 20 of a surround layer sheet580. In the later regard, the surround layer sheet 580 may comprise aplurality of regions 581 in corresponding relation to the plurality ofsheet regions 501 from which card bodies will be separated. Moreparticularly, each of the plurality of regions 581 may include a portioncorresponding with a surround 22 having a projection 24 and opening 20,as described in relation to FIGS. 20-24 above. In that regard, theplurality of metallic members 10 and a plurality of openings 20 may besized for press-fit positioning of the metallic members 10 in theopenings 20. In that regard, each of the metallic members 10 may be of asubstantially equal thickness which is equal to or preferably not lessthan 90% of a thickness of the surround layer sheet 580.

As further illustrated in FIG. 31D, after the positioning of theplurality of metallic members 10 in the plurality of openings 20, acorresponding plurality of antennas 28 may be provided in correspondingrelation to the plurality of regions 581, each as described in relationto FIGS. 20-24 above. Thereafter, and as shown in FIG. 31E, opposingfilm layer sheets 590 may be provided on each side of the surround layersheet 580 to yield the inlay sheet 101 a of multi-layer assembly 500.

Returning now to FIG. 30, in contemplated embodiments a first innerpolymer-based adhesive sheet-like layer may be provided between theinward-facing side of the first graphics sheet 510 and a first side ofthe inlay sheet 101 a facing the first graphics sheet 510, and a secondinner polymer-based adhesive sheet-like layer may be provided betweenthe inward-facing side of the second graphics sheet 520 and a secondside of inlay sheet 101 a facing the second graphics sheet 520 as partof the multi-sheet assembly 500. Further, in contemplated embodiments afirst outer thermosetting sheet-like layer may be provided between theoutward-facing side of the first graphics sheet 510 and theinward-facing side of the first film sheet 560, and a second outerthermosetting sheet-like layer may be provided between theoutward-facing side of the second graphics sheet 520 and theinward-facing side of the second film sheet 562 as part of themulti-sheet assembly 500. In one approach, the first and second outersheet-like thermosetting layers may be coatings applied to theinward-facing sides of the first and second film sheets, respectively.

To interconnect the first film sheet 562, first graphics sheet 510,inlay sheet 101 a, second graphics sheet 520 and second film sheet 562,the multi-sheet assembly 500, the above-referenced polymer-basedadhesive layers and thermosetting layers may be activated by heatingthen cooled to define layers corresponding with layers 450, 452, 454 and456 referenced above. In that regard, and with reference to FIG. 32,heat and pressure may be applied to the multi-layer assembly 500 viaopposing platens 200 of a lamination device on opposing sides of themulti-layer assembly 500. In some implementations, the applied heat maybe provided so that a temperature within and across the multi-layerassembly 500 (e.g. an assembly having a combined thickness of about0.762 mm (30 mils) to 0.864 mm (34 mils), and no more than 0.838 mm (33mils) after lamination) reaches a temperature of at least 240°Fahrenheit and no more than, or less than, about 270° Fahrenheit. Afterheating, the platens 200 may be cooled to cool the multi-sheet assembly500.

Following interconnection of various sheets and thermoset layers of themulti-sheet assembly 500, a plurality of card bodies 503 may beseparated from the multi-sheet assembly 500, as shown in FIG. 33.Further, prior to, in conjunction with, or after such separation,pockets 26 may be defined in predetermined relation to each of the cardbodies 503 to be separated from the multi-sheet assembly 500. In oneapproach, each of the pockets 26 may be milled (e.g. utilizing acomputer numeric controlled milling machine), followed by separation ofthe card bodies 503 from the multi-sheet assembly 500 via milling (e.g.utilizing a computer numeric controlled milling machine). In anotherapproach, pockets 26 (e.g. pocket portions P1 and P2 referenced above)may be milled separately in each card body 503, in line on a smartcardstandalone milling machine or on an inline milling station on a smartcard processing machine. In any case, each of the card bodies 503 may beseparately provided with an IC chip module 480 and otherwisepersonalized as described above, to yield a finished transaction card401.

It may be further appreciated that ISO 7810 and/or ISO 7816,incorporated by reference above, may also prescribe requirements for thephysical characteristics of cards such as bending stiffness,flammability, toxicity, resistance to chemicals, car dimensionalstability and warpage with temperature and humidity, resistance todeterioration from exposure to light and heat, and durability. It may beappreciated that the foregoing weighted transaction cards and methods ofmanufacturing the same may result in finished transaction cards thatmeet the standards set forth in ISO 7810, ISO 7816, and/or any otherregulations, rules, or standards applicable to transaction cards.

The foregoing description of the present invention has been presentedfor purposes of illustration and description. Furthermore, thedescription is not intended to limit the invention to the form disclosedherein. Consequently, variations and modifications commensurate with theabove teachings, and skill and knowledge of the relevant art, are withinthe scope of the present invention. The embodiments describedhereinabove are further intended to explain known modes of practicingthe invention and to enable others skilled in the art to utilize theinvention in such or other embodiments and with various modificationsrequired by the particular application(s) or use(s) of the presentinvention. It is intended that the appended claims be construed toinclude alternative embodiments to the extent permitted by the priorart.

What is claimed is:
 1. A transaction card, comprising: a smart card chipdisposed in a pocket; an inlay comprising: a metallic member having arelief portion to provide a space for said pocket, wherein the metallicmember comprises not less than about 40% of the total weight of thetransaction card; a surround having an opening for receiving themetallic member therein; and, an antenna member provided on thesurround, wherein said antenna member comprises an outer first portionthat extends a plurality of times about said opening of the surround; afirst graphics layer attached to a first side of the inlay; a secondgraphics layer attached to a second side of the inlay; and, indiciaindicative of an account associated with the transaction card.
 2. Atransaction card according to claim 1, wherein the opening extendsthrough the surround and the inlay further comprises: a first film layerapplied to a first side of the surround and metallic member over theopening; and, a second film layer applied to a second side of thesurround and metallic member over the opening.
 3. A transaction cardaccording to claim 2, wherein said first graphics layer, said secondgraphics layer and said first inlay extend from edge-to-edge across alength and a width of the transaction card.
 4. A transaction cardaccording to claim 1, wherein said antenna member is provided to be atleast partially inset in to the surround.
 5. A transaction cardaccording to claim 1, wherein said antenna member is provided on adiscrete layer.
 6. A transaction card according to claim 1, wherein saidrelief portion is provided by an opening through the metallic member anda plug is provided in said opening of the metallic member and milled toprovide said pocket.
 7. A transaction card according to claim 1, whereinsaid relief portion is provided by a recess at an outer edge of themetallic member and the surround includes a projection that extends into the recess and is milled to provide said pocket.
 8. A transactioncard according to claim 1, wherein the entire first portion of theantenna member is disposed at least 2 mm inward from an outer peripheryof the surround, and at least 1 mm outward from an outward periphery ofthe metallic member.
 9. A transaction card according to claim 1, whereinsaid metallic member is a tungsten member having a length not less thanabout 50% of a length of the transaction card, and having a width notless than about 50% of a width of the transaction card.
 10. Atransaction card according to claim 1, wherein said antenna membercomprises an inner second portion that extends a plurality of timesabout said pocket within said space provided by said relief portion ofthe metallic member.
 11. A transaction card according to claim 10,wherein said smart card chip is supportably interconnected to adownward-facing side of a substrate and electrically interconnected toanother antenna member that is supportably interconnected to saiddownward-facing side of said substrate in spaced and at least partiallyoverlapping relation to said second portion of said antenna member forinductive coupling therewith.
 12. A transaction card according to claim11, wherein said another antenna member extends a plurality of timesabout said smart card chip.
 13. A transaction card according to claim10, wherein said antenna member comprises an intermediate portion thatextends between said outer first portion and said second portion of theantenna member.
 14. A transaction card according to claim 13, whereinsaid relief portion is provided by an opening through the metallicmember and a plug is provided in said opening of the metallic member andmilled to provide said pocket, wherein said second portion of theantenna is provided on said plug, and wherein said intermediate portionof the antenna extends along a groove provided in said metallic member.15. A transaction card according to claim 14, wherein said antennamember is provided to be at least partially inset in to the plug.
 16. Atransaction card according to claim 13, wherein said relief portion isprovided by a recess at an outer edge of the metallic member and thesurround includes a projection that extends in to the recess and milledto provide said pocket, wherein said second portion of the antenna isprovided on an end portion of said projection, and wherein saidintermediate portion of the antenna extends along said projection.
 17. Atransaction card according to claim 16, wherein said antenna member isprovided to be at least partially inset in to the projection of thesurround.
 18. A transaction card according to claim 13, wherein saidantenna member comprises a continuous length of metal.
 19. A transactioncard according to claim 18, wherein said antenna member is defined by anelectrically-conductive metal wire having an electrically non-conductiveouter layer, and wherein at least said first portion of the antennamember is partially embedded in said surround.
 20. A transaction cardaccording to claim 19, wherein the metallic member has thickness that issubstantially equal to a thickness of the surround.
 21. A transactioncard according to claim 13, wherein said antenna member is provided on adiscrete layer.
 22. A transaction card according to claim 13, whereinsaid smart card chip is supportably interconnected to a downward-facingside of a substrate, and further comprising: a plurality of contact padssupportably interconnected to an outward-facing side of the substrateand electrically interconnected to the smartcard chip through thesubstrate.
 23. A transaction card according to claim 1, wherein saidantenna member comprises an intermediate portion that includes first andsecond sections electrically interconnected to the first portion of theantenna member.
 24. A transaction card according to claim 23, whereinsaid relief portion is provided by a recess at an outer edge of themetallic member and the surround includes a projection that extends into the recess and milled to provide said pocket, and wherein saidintermediate portion of the antenna extends along said projection.
 25. Atransaction card according to claim 23, wherein said smart card chip issupportably interconnected to a downward-facing side of a substrate, andfurther comprising: a plurality of contact pads supportablyinterconnected to an outward facing side of the substrate andelectrically interconnected to the smartcard chip through the substrate.26. A transaction card according to claim 23, wherein said antennamember comprises an inner second portion that extends a plurality oftimes about said pocket within said space provided by said reliefportion of the metallic member and is electrically interconnected to thefirst and second sections of the intermediate portion, and wherein saidsmart card chip is supportably interconnected to a downward-facing sideof a substrate and electrically interconnected to another antenna memberthat is supportably interconnected to said downward-facing side of saidsubstrate in spaced and at least partially overlapping relation to saidsecond portion of said antenna member for inductive coupling therewith.27. A transaction card according to claim 26, wherein said anotherantenna member extends a plurality of times about said smart card chip.28. A transaction card according to claim 23, wherein the first andsecond sections of the intermediate portion of said antenna member areelectrically interconnected to different corresponding electricallyconductive contact pads directly electrically interconnected todifferent contacts of said smartcard chip.
 29. A transaction cardaccording to claim 23, wherein a first section of said first portion ofthe antenna member extends from a first free end about the opening ofthe surround to the first section of the intermediate portion, andwherein a second section of the first portion of the antenna memberextends from a second free end to the second section of the intermediateportion of the antenna member.